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0.8 0.40 0.23 28.5 8.7 2.8 10.2 10.5
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT232-1
95-02-04
1996 Jul 18 42
seating plane
Philips Semiconductors Preliminary specification
Autosync Deflection Controller (ASDC) TDA4855
The device may be mounted up to the seating plane, but
SOLDERING
the temperature of the plastic body must not exceed the
Introduction
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
There is no soldering method that is ideal for all IC
may be necessary immediately after soldering to keep the
packages. Wave soldering is often preferred when
temperature within the permissible limit.
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
Repairing soldered joints
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
Apply a low voltage soldering iron (less than 24 V) to the
situations reflow soldering is often used.
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
This text gives a very brief insight to a complex technology.
soldering iron bit is less than 300 °C it may remain in
A more in-depth account of soldering ICs can be found in
contact for up to 10 seconds. If the bit temperature is
our IC Package Databook (order code 9398 652 90011).
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jul 18 43
Philips Semiconductors a worldwide company
Argentina: see South America Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 83749, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Belgium: see The Netherlands
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
51 James Bourchier Blvd., 1407 SOFIA,
Portugal: see Spain
Tel. +359 2 689 211, Fax. +359 2 689 102
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 708 296 8556 Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 926 5361, Fax. +7 095 564 8323
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +852 2319 7888, Fax. +852 2319 7700 Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America Slovakia: see Austria
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